Soudure sans plomb Sn99% / Ag0.3% / Cu0.7%

Soudure sans plomb Sn99% / Ag0.3% / Cu0.7%

A cost-effective lead free solder. ■ Composition: Sn 99% / Ag 0.3% / Cu 0.7%

· A cost-effective lead free solder.
· Uses flux with excellent wettability, keeping any drops in workability to a minimum.
· Even when switching from Sn-3Ag-0.5Cu solder to another type, no major changes need to be made in regards working methods or the equipment used.
· Tin-lead solder has been used for a long time and boasts a lot of plus-points in terms of its wettability, melting point, mechanical strength, and copper leaching, etc. However, lead also has a number of unwanted effects on the environment, and as such has led to a number of lead free solder alloys being made.
· As the melting point of lead free solder is high and the solder alloys themselves have a large specific heat capacity, this tends to result in reduced workability.

Référence pièce

Vous pouvez trouver ici le numéro
de référence lié au produit recherché.

Référence pièce
Référence piècePrix unitaire standardRemise sur volumeNombre de jours d'expédition?RoHSType Diamètre de fil

26.84 €

6 jours 6Bobine type M0.3

19.40 €

4 jours 6Bobine type M0.6

17.16 €

4 jours 6Bobine type M1.0

65.64 €

6 jours 6Bobine type L0.6

60.44 €

6 jours 6Bobine type L0.8

57.29 €

4 jours 6Bobine type L1.0


  1. 1

Informations de base

Sans plomb Correspond à

Autres produits de cette catégorie

Les clients qui ont consulté cet article ont également consulté

Assistance technique