Ventouses（Matériau du groupe de résine：POM）

?* À propos du délai d'expédition et des prix

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  Ventouse à vide, modèle anti-traces d'adsorption VPF

  NIHON PISCO

  *The CAD data for this series is being revised. This will be available as soon as modifications are complete.
  
  [Features]
  · Ideal for LCD glass, coating processes, transport of semiconductor manufacturing equipment.
  · The flexible resin material adheres to the workpiece.
  · Unlikely to make adhesion marks.
  · Also improves the separation characteristic of the workpiece when the vacuum suction ends.
  · You can replace the resin pad without spanners and hexagon wrenches to detach the main body.
  · Simple and compact structure.
  · A wide range of pad sizes, pad materials, and holder shapes are available.
  · Pad holders have been added for applications requiring "no use of copper-based metal" and "reduced ozone concentrations."
  · Copper-based metal is not used for metal parts. HNBR is used for sealing rubber material.

  Fichiers CAD 2D / 3D disponibles

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  à partir de∗ ：	71.93 €
  Délai d'expédition minimum ：	10 jours

  *Prix unitaire/configuration de base

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