?* À propos du délai d'expédition

• 

  Sparkle ESC

  SENJU METAL INDUSTRY

  Lead free solder. Its excellent wettability, solder-freeing performance, and reliability provide improved workability.
  
  [Features]
  · Solder paste.
  · [Eco Solder paste].
  · "Eco Solder" is an environmentally friendly lead free solder paste that, when compared to traditional solder pastes, helps resolve problems such as heat-resistance (due to a high melting point), supply stability, wettability, and preservation stability—a problem associated with lead free solder.
  · [S70G series].
  · Maintains the viscosity stability of the GRN364 series by preservation and squeezing, while also providing improved reliability and performance in terms of heat-resistance and flux spattering. Improves in all aspects; from product mounting to production.
  · Drastically improves the ability to prevent incomplete BGA fusion, which has been difficult to solve.
  · Types which can improve thermostability and maintain temperature are also available.
  · [374FS series].
  · Developed for joining large surface areas such as during semi-conductor module mounting. Displays excellent cleaning properties with various types of cleaning solution. Reduces the occurrence of voids which form on the underside of bare chips, etc.
  · [TVA series].
  · A lead-free solder paste developed for usage in 3D implementation such as POP.
  · [DSR series].
  · A lead free solder paste for dispensing. Combines characteristics, enabling use with a wide range of applications.
  · As well as general reflow heating, it also supports other heating methods such as rapid heating (laser, hot air, etc.)
  · [345F series].
  · Features improved cleaning of residues with various types of cleaning solution. Boasts heat-resistance and viscosity stability while also inhibiting the formation of solder balls.

  à partir de∗ ：	65.36 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Soldering Tools, Lead-free Solder (Round, Stick)

  MISUMI

  Highly reliable lead-free solder as good as Sn-Pb-based solder

  à partir de∗ ：	48.46 €
  Délai d'expédition minimum ：	5 jours

  *Prix unitaire/configuration de base

• 

  Soldering Tools, Solder Reel Mount

  MISUMI

  Wire solders can be taken out smoothly

  à partir de∗ ：	17.85 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Soudure âme à flux de résine, Solder Ace E28

  NIHON GENMA

  Manufactured by Nihon Genma. A high quality and highly reliable resin flux cored solder.
  
  [Features]
  · Solder Ace E28 is a high performance flux cored solder with excellent solderability and insulating properties.
  · The majority of resin flux cored solders in general use today use additives that cause the flux to activate. This leads to an unbalanced composition, which in turn causes the working stability of the flux to degrade. Moisture resistance also caused problems when it comes to preventing degradation of the insulation resistance.
  · However, Solder Ace E28 flux has been specially processed and manufactured using unique active ingredients so that problems such as those mentioned above do not occur. On top of this it also displays excellent solderability and insulating properties.
  · Solder Ace E28 also does not emit any unpleasant smelling gas during soldering, and is a product that can be relied upon.
  · It also uses solder featuring low levels of impurities, which in turn makes it easy to work with.
  · Solder Ace E28 maintains an even quality through careful application and management, making it ideal for soldering with automatic machines.

  à partir de∗ ：	67.18 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Soldering Tools, Lead-free Solder (with Resin)

  MISUMI

  Easy to carry with included case

  à partir de∗ ：	5.31 €
  Délai d'expédition minimum ：	5 jours

  *Prix unitaire/configuration de base

• 

  Soudure pour acier inoxydable (H-710)

  HOZAN

  Works not only with aluminum and titanium, but also a large number of other metals. The wire diameter is ø1.6 mm and its length is 2.5 m. Its composition is Sn40% and Pb60%.
  
  [Features]
  · Can be used not only with aluminum and titanium, but also with stainless steel, nichrome, copper, brass, nickel plating, zinc plating, bimetal, tin plating, and steel, etc.
  · Uses a water-soluble flux which can be easily removed with water.

  à partir de∗ ：	14.58 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Soudure sans plomb Sn99% / Ag0.3% / Cu0.7%

  HOZAN

  A cost-effective lead free solder. ■ Composition: Sn 99% / Ag 0.3% / Cu 0.7%
  
  [Features]
  · A cost-effective lead free solder.
  · Uses flux with excellent wettability, keeping any drops in workability to a minimum.
  · Even when switching from Sn-3Ag-0.5Cu solder to another type, no major changes need to be made in regards working methods or the equipment used.
  · Tin-lead solder has been used for a long time and boasts a lot of plus-points in terms of its wettability, melting point, mechanical strength, and copper leaching, etc. However, lead also has a number of unwanted effects on the environment, and as such has led to a number of lead free solder alloys being made.
  · As the melting point of lead free solder is high and the solder alloys themselves have a large specific heat capacity, this tends to result in reduced workability.

  à partir de∗ ：	18.50 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Soudure étain-plomb Sn60% / Pb40%

  HOZAN

  Composition: Sn 60% / Pb40%
  
  [Features]
  · A "no-wash" type for micro soldering. For minimizing fine pitch parts and CFC elimination.
  · Uses an anti-static countermeasure bobbin.

  à partir de∗ ：	9.92 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Soudure sans plomb Sn96.5% / Ag3% / Cu0.5%

  HOZAN

  Lead free solder. Uses JEITA recommended alloys.
  
  [Features]
  · Features low-spatter flux.
  · A JEITA recommended alloy lead free solder. Highly reliable and with a proven track record.

  à partir de∗ ：	11.21 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Soudure sans plomb Sn99.3% / Cu+Ni0.7%

  HOZAN

  Lead Free Solder/Flux Characteristics: RMA Composition: Sn 99.3% / Cu+Ni0.7%
  
  [Features]
  · Lead free solder with a glossy finish close to that of tin-lead solder.
  · Solder with comparatively low rates of copper leaching and soldering iron tip damage.

  à partir de∗ ：	16.51 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Soudure étain-plomb Sn50% / Pb50%

  HOZAN

  Flux Characteristics: RA Composition: Sn 50% / Pb50%
  
  [Features]
  · Can be used not only with aluminum and titanium, but also with stainless steel, nichrome, copper, brass, nickel plating, bimetal, tin-plate, steel, and many other metals.
  · Uses a water-soluble flux which can be easily removed with water.

  à partir de∗ ：	16.36 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Soudure sans plomb, âme à flux de résine

  NIHONSUPERIOR

  An updated SN100C (010) product. Boasts excellent wettability. Helps prevent solder bridging and shrinkage.
  
  [Features]
  · Has great results when used for wave soldering. Suitable for the soldering of products with large usage environment loads.
  · The effects of the trace additives nickel and germanium help provide excellent workability and inhibit the generation of solder bridging and shrinkage.
  · Creates a nickel barrier, inhibiting copper leaching.
  · Is affected little by harsh conditions, helping ensure stable quality (atmospheric exposure test).
  · Features excellent growth characteristics, helping mitigate the effects of expansion and contraction resulting from heat generated by components and circuit boards.
  · Reduces the generation of dross.

  à partir de∗ ：	38.04 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Soudure sans plomb

  NIHONSUPERIOR

  Flux-less solder.
  
  [Features]
  · Has great results when used for wave soldering. Suitable for the soldering of products with large usage environment loads.
  · The effects of the trace additives nickel and germanium help provide excellent workability and inhibit the generation of solder bridging and shrinkage.
  · Creates a nickel barrier, inhibiting copper leaching.
  · Is affected little by harsh conditions, helping ensure stable quality (atmospheric exposure test).
  · Features excellent growth characteristics, helping mitigate the effects of expansion and contraction resulting from heat generated by components and circuit boards.
  · Reduces the generation of dross.

  à partir de∗ ：	35.63 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  · Eco Solder, RMA02

  SENJU METAL INDUSTRY

  Highly reliable solder with excellent workability.
  
  [Features]
  · Solder paste.
  · [Eco Solder paste].
  · "Eco Solder" is an environmentally friendly lead free solder paste that, when compared to traditional solder pastes, helps resolve problems such as heat-resistance (due to a high melting point), supply stability, wettability, and preservation stability—a problem associated with lead free solder.
  · [S70G series].
  · Maintains the viscosity stability of the GRN360 series by preservation and squeezing, while also providing improved reliability and performance in terms of heat-resistance and flux spattering. Improves in all aspects; from product mounting to production.
  · Drastically improves the ability to prevent incomplete BGA fusion, which has been difficult to solve.
  · Types that can improve the thermostability of active ingredients and maintain temperature are also available.
  · [374FS series].
  · Developed for joining large surface areas such as during semi-conductor module mounting. Displays excellent cleaning properties with various types of cleaning solution. Reduces the occurrence of voids which form on the underside of bare chips, etc.
  · [TVA series].
  · A lead-free solder paste developed for usage in 3D implementation such as POP.
  · [DSR series].
  · A lead free solder paste for dispensing. Combines characteristics, enabling use with a wide range of applications.
  · As well as general reflow heating, it also supports other heating methods such as rapid heating (laser, hot air, etc.)
  · [345F series].
  · Features improved cleaning of residues with various types of cleaning solution. Boasts heat-resistance and viscosity stability while also inhibiting the formation of solder balls.

  à partir de∗ ：	68.92 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Barre Eco Solder

  SENJU METAL INDUSTRY

  A highly reliable solder bar.
  
  [Features]
  · Solder paste.
  · [Eco Solder paste].
  · "Eco Solder" is an environmentally friendly lead free solder paste that, when compared to traditional solder pastes, helps resolve problems such as heat-resistance (due to a high melting point), supply stability, wettability, and preservation stability—a problem associated with lead free solder.
  · [S70G series].
  · Maintains the viscosity stability of the GRN362 series by preservation and squeezing, while also providing improved reliability and performance in terms of heat-resistance and flux spattering. Improves in all aspects; from product mounting to production.
  · Drastically improves the ability to prevent incomplete BGA fusion, which has been difficult to solve.
  · Types which can improve the thermostability of ingredients and maintain temperature are also available.
  · [374FS series].
  · Developed for joining large surface areas such as during semi-conductor module mounting. Displays excellent cleaning properties with various types of cleaning solution. Reduces the occurrence of voids which form on the underside of bare chips, etc.
  · [TVA series].
  · A lead-free solder paste developed for usage in 3D implementation such as POP.
  · [DSR series].
  · A lead free solder paste for dispensing. Combines characteristics, enabling use with a wide range of applications.
  · As well as general reflow heating, it also supports other heating methods such as rapid heating (laser, hot air, etc.)
  · [345F series].
  · Features improved cleaning of residues with various types of cleaning solution. Boasts heat-resistance and viscosity stability while also inhibiting the formation of solder balls.

  à partir de∗ ：	93.37 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Série KR-19 RMA

  NIHON ALMIT

  A "no-clean" compatible product. Ideal for automatic soldering devices.

  à partir de∗ ：	98.12 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Série KR-19 SH RMA

  NIHON ALMIT

  Ideal for automatic soldering devices.

  • Remise sur volume

  à partir de∗ ：	130.65 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Série KR-19

  NIHON ALMIT

  Compatible with materials that are not easy to solder to such as nickel and stainless steel, etc.

  à partir de∗ ：	98.12 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Soudure sans plomb, âme à flux de résine, Solder Ace DHB

  NIHON GENMA

  Manufactured by Nihon Genma. Spatter preventing resin flux cored solder.
  
  [Features]
  · Reduced flux spatter.
  · Improved wetting range.
  · Features improved wetting onto nickel in particular.
  · AA grade reliability (RMA equivalent product) guaranteed.

  à partir de∗ ：	64.04 €
  Délai d'expédition minimum ：	3 jours

  *Prix unitaire/configuration de base

• 

  Soudure âme à flux, Solder Ace HQ5-RMA

  NIHON GENMA

  Manufactured by Nihon Genma. Drastically improved initial wettability and spatter performance. Passed RMA tests
  
  [Features]
  · Highly reliable rosin flux cored solder suitable for high speed soldering.
  · HQ5-RMA is a high performance rosin flux cored solder with superior wettability and cutting, with initial wettability that has been significantly improved over conventional products.
  · As well as fulfilling the harsh conditions stipulated by RMA, it also does not cause metals to migrate and can be uses as a "no-clean" type.

  à partir de∗ ：	77.19 €
  Délai d'expédition minimum ：	22 jours

  *Prix unitaire/configuration de base

• 

  Soudure sans plomb, âme à flux de résine

  NIHON GENMA

  Manufactured by Nihon Genma. Resin flux cored solder with ultra low spattering and excellent wetting performance.
  
  [Features]
  · Has all the features of resin flux cored solder.
  · A resin flux cored solder which exhibits both "excellent wetting" and "spatter control" to a high level, two features which were previously not possible with solders of this type.

  à partir de∗ ：	67.45 €
  Délai d'expédition minimum ：	22 jours

  *Prix unitaire/configuration de base

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