Nombre de jours d'expédition |
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?* À propos du délai d'expédition et des prix
NIHONSUPERIOR
An updated SN100C (010) product. Boasts excellent wettability. Helps prevent solder bridging and shrinkage.
[Features]
· Has great results when used for wave soldering. Suitable for the soldering of products with large usage environment loads.
· The effects of the trace additives nickel and germanium help provide excellent workability and inhibit the generation of solder bridging and shrinkage.
· Creates a nickel barrier, inhibiting copper leaching.
· Is affected little by harsh conditions, helping ensure stable quality (atmospheric exposure test).
· Features excellent growth characteristics, helping mitigate the effects of expansion and contraction resulting from heat generated by components and circuit boards.
· Reduces the generation of dross.
à partir de∗ : | 61.18 € |
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Délai d'expédition minimum : | 6 jours |
*Prix unitaire/configuration de base
SENJU METAL INDUSTRY
A highly reliable solder bar.
[Features]
· Solder paste.
· [Eco Solder paste].
· "Eco Solder" is an environmentally friendly lead free solder paste that, when compared to traditional solder pastes, helps resolve problems such as heat-resistance (due to a high melting point), supply stability, wettability, and preservation stability—a problem associated with lead free solder.
· [S70G series].
· Maintains the viscosity stability of the GRN362 series by preservation and squeezing, while also providing improved reliability and performance in terms of heat-resistance and flux spattering. Improves in all aspects; from product mounting to production.
· Drastically improves the ability to prevent incomplete BGA fusion, which has been difficult to solve.
· Types which can improve the thermostability of ingredients and maintain temperature are also available.
· [374FS series].
· Developed for joining large surface areas such as during semi-conductor module mounting. Displays excellent cleaning properties with various types of cleaning solution. Reduces the occurrence of voids which form on the underside of bare chips, etc.
· [TVA series].
· A lead-free solder paste developed for usage in 3D implementation such as POP.
· [DSR series].
· A lead free solder paste for dispensing. Combines characteristics, enabling use with a wide range of applications.
· As well as general reflow heating, it also supports other heating methods such as rapid heating (laser, hot air, etc.)
· [345F series].
· Features improved cleaning of residues with various types of cleaning solution. Boasts heat-resistance and viscosity stability while also inhibiting the formation of solder balls.
à partir de∗ : | 99.91 € |
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Prix spécial | |
Délai d'expédition minimum : | Jour même |
*Prix unitaire/configuration de base
HOZAN
A cost-effective lead free solder. ■ Composition: Sn 99% / Ag 0.3% / Cu 0.7%
[Features]
· A cost-effective lead free solder.
· Uses flux with excellent wettability, keeping any drops in workability to a minimum.
· Even when switching from Sn-3Ag-0.5Cu solder to another type, no major changes need to be made in regards working methods or the equipment used.
· Tin-lead solder has been used for a long time and boasts a lot of plus-points in terms of its wettability, melting point, mechanical strength, and copper leaching, etc. However, lead also has a number of unwanted effects on the environment, and as such has led to a number of lead free solder alloys being made.
· As the melting point of lead free solder is high and the solder alloys themselves have a large specific heat capacity, this tends to result in reduced workability.
à partir de∗ : | 22.35 € |
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Délai d'expédition minimum : | 6 jours |
*Prix unitaire/configuration de base
HOZAN
Composition: Sn 60% / Pb40%
[Features]
· A "no-wash" type for micro soldering. For minimizing fine pitch parts and CFC elimination.
· Uses an anti-static countermeasure bobbin.
à partir de∗ : | 8.30 € |
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Délai d'expédition minimum : | 6 jours |
*Prix unitaire/configuration de base
SENJU METAL INDUSTRY
Lead free solder. Its excellent wettability, solder-freeing performance, and reliability provide improved workability.
[Features]
· Solder paste.
· [Eco Solder paste].
· "Eco Solder" is an environmentally friendly lead free solder paste that, when compared to traditional solder pastes, helps resolve problems such as heat-resistance (due to a high melting point), supply stability, wettability, and preservation stability—a problem associated with lead free solder.
· [S70G series].
· Maintains the viscosity stability of the GRN364 series by preservation and squeezing, while also providing improved reliability and performance in terms of heat-resistance and flux spattering. Improves in all aspects; from product mounting to production.
· Drastically improves the ability to prevent incomplete BGA fusion, which has been difficult to solve.
· Types which can improve thermostability and maintain temperature are also available.
· [374FS series].
· Developed for joining large surface areas such as during semi-conductor module mounting. Displays excellent cleaning properties with various types of cleaning solution. Reduces the occurrence of voids which form on the underside of bare chips, etc.
· [TVA series].
· A lead-free solder paste developed for usage in 3D implementation such as POP.
· [DSR series].
· A lead free solder paste for dispensing. Combines characteristics, enabling use with a wide range of applications.
· As well as general reflow heating, it also supports other heating methods such as rapid heating (laser, hot air, etc.)
· [345F series].
· Features improved cleaning of residues with various types of cleaning solution. Boasts heat-resistance and viscosity stability while also inhibiting the formation of solder balls.
Délai d'expédition minimum : | 10 jours |
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HOZAN
Lead free solder. Uses JEITA recommended alloys.
[Features]
· Features low-spatter flux.
· A JEITA recommended alloy lead free solder. Highly reliable and with a proven track record.
à partir de∗ : | 10.86 € |
---|---|
Délai d'expédition minimum : | 6 jours |
*Prix unitaire/configuration de base
HOZAN
Lead Free Solder/Flux Characteristics: RMA Composition: Sn 99.3% / Cu+Ni0.7%
[Features]
· Lead free solder with a glossy finish close to that of tin-lead solder.
· Solder with comparatively low rates of copper leaching and soldering iron tip damage.
à partir de∗ : | 22.93 € |
---|---|
Délai d'expédition minimum : | 6 jours |
*Prix unitaire/configuration de base
HOZAN
Flux Characteristics: RA Composition: Sn 50% / Pb50%
[Features]
· Can be used not only with aluminum and titanium, but also with stainless steel, nichrome, copper, brass, nickel plating, bimetal, tin-plate, steel, and many other metals.
· Uses a water-soluble flux which can be easily removed with water.
à partir de∗ : | 20.02 € |
---|---|
Délai d'expédition minimum : | 6 jours |
*Prix unitaire/configuration de base
NIHONSUPERIOR
Flux-less solder.
[Features]
· Has great results when used for wave soldering. Suitable for the soldering of products with large usage environment loads.
· The effects of the trace additives nickel and germanium help provide excellent workability and inhibit the generation of solder bridging and shrinkage.
· Creates a nickel barrier, inhibiting copper leaching.
· Is affected little by harsh conditions, helping ensure stable quality (atmospheric exposure test).
· Features excellent growth characteristics, helping mitigate the effects of expansion and contraction resulting from heat generated by components and circuit boards.
· Reduces the generation of dross.
à partir de∗ : | 66.70 € |
---|---|
Délai d'expédition minimum : | 6 jours |
*Prix unitaire/configuration de base
SENJU METAL INDUSTRY
Highly reliable solder with excellent workability.
[Features]
· Solder paste.
· [Eco Solder paste].
· "Eco Solder" is an environmentally friendly lead free solder paste that, when compared to traditional solder pastes, helps resolve problems such as heat-resistance (due to a high melting point), supply stability, wettability, and preservation stability—a problem associated with lead free solder.
· [S70G series].
· Maintains the viscosity stability of the GRN360 series by preservation and squeezing, while also providing improved reliability and performance in terms of heat-resistance and flux spattering. Improves in all aspects; from product mounting to production.
· Drastically improves the ability to prevent incomplete BGA fusion, which has been difficult to solve.
· Types that can improve the thermostability of active ingredients and maintain temperature are also available.
· [374FS series].
· Developed for joining large surface areas such as during semi-conductor module mounting. Displays excellent cleaning properties with various types of cleaning solution. Reduces the occurrence of voids which form on the underside of bare chips, etc.
· [TVA series].
· A lead-free solder paste developed for usage in 3D implementation such as POP.
· [DSR series].
· A lead free solder paste for dispensing. Combines characteristics, enabling use with a wide range of applications.
· As well as general reflow heating, it also supports other heating methods such as rapid heating (laser, hot air, etc.)
· [345F series].
· Features improved cleaning of residues with various types of cleaning solution. Boasts heat-resistance and viscosity stability while also inhibiting the formation of solder balls.
Délai d'expédition minimum : | 6 jours |
---|
à partir de∗ : | 117.52 € |
---|---|
Délai d'expédition minimum : | 6 jours |
*Prix unitaire/configuration de base
NIHON ALMIT
Compatible with materials that are not easy to solder to such as nickel and stainless steel, etc.
à partir de∗ : | 117.52 € |
---|---|
Délai d'expédition minimum : | 6 jours |
*Prix unitaire/configuration de base
Marque |
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Série du produit |
à partir de∗ |
Délai d'expédition minimum |
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Marque | NIHONSUPERIOR | SENJU METAL INDUSTRY | HOZAN | HOZAN | SENJU METAL INDUSTRY | HOZAN | HOZAN | HOZAN | NIHONSUPERIOR | SENJU METAL INDUSTRY | NIHON ALMIT | NIHON ALMIT |
Série du produit | ||||||||||||
à partir de∗ | 61.18 € *Prix unitaire/configuration de base | 99.91 € Prix spécial *Prix unitaire/configuration de base En promotion jusqu’au 31/03/2023Remise sur volume | 22.35 € *Prix unitaire/configuration de base | 8.30 € *Prix unitaire/configuration de base | - | 10.86 € *Prix unitaire/configuration de base Remise sur volume | 22.93 € *Prix unitaire/configuration de base | 20.02 € *Prix unitaire/configuration de base Remise sur volume | 66.70 € *Prix unitaire/configuration de base | - | 117.52 € *Prix unitaire/configuration de base | 117.52 € *Prix unitaire/configuration de base |
Délai d'expédition minimum | 6 jours | Jour même | 6 jours | 6 jours | 10 jours | 6 jours | 6 jours | 6 jours | 6 jours | 6 jours | 6 jours | 6 jours |
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