Soudure sans plomb (Numéros de référence)
Flux-less solder.
[Features]
· Has great results when used for wave soldering. Suitable for the soldering of products with large usage environment loads.
· The effects of the trace additives nickel and germanium help provide excellent workability and inhibit the generation of solder bridging and shrinkage.
· Creates a nickel barrier, inhibiting copper leaching.
· Is affected little by harsh conditions, helping ensure stable quality (atmospheric exposure test).
· Features excellent growth characteristics, helping mitigate the effects of expansion and contraction resulting from heat generated by components and circuit boards.
· Reduces the generation of dross.
[Features]
· Has great results when used for wave soldering. Suitable for the soldering of products with large usage environment loads.
· The effects of the trace additives nickel and germanium help provide excellent workability and inhibit the generation of solder bridging and shrinkage.
· Creates a nickel barrier, inhibiting copper leaching.
· Is affected little by harsh conditions, helping ensure stable quality (atmospheric exposure test).
· Features excellent growth characteristics, helping mitigate the effects of expansion and contraction resulting from heat generated by components and circuit boards.
· Reduces the generation of dross.
Référence pièce
Vous pouvez trouver ici le numéro
de référence lié au produit recherché.
SN100C-20
Informations de base
| Âme à flux de résine | Aucun flux | Contenu(g) | Environ 400 | Forme | Tige |
|---|
Configurer
Propriétés de base
Filtrer par jours d'expédition standard
-
- Tous les articles
- 26 jours ou moins
Propriétés optionnelles
- Les spécifications et les dimensions de certaines pièces peuvent ne pas être intégralement indiquées. Pour plus de détails, reportez-vous aux catalogues des fabricants .
Assistance technique
Mode de paiement
Fabrication à la demande
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